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    Developer Coater Scrubber Stripper Etcher Temporary Bonding Tool Scribe & Break Machine

    KS-CF300/200-8SR Single-wafer scrubber for IC manufacturing

    KS-CF300/200-8SR employs a variety of technologies to clean front side, back side, and bevel area of wafer, all within the same equipment. A Two-fluid nozzle is used to efficiently remove both large and fine particles from wafer surface with a high removal rate.
    Advantages：

    1. Full anti-static piping
    2. Minimum number of contact points of reversing unit with wafer
    3. All-digital instrumentation and full data logging for easy tracing.
    4. Fully optimized wafer transfer path for higher throughput
    5. User-friendly GUI and full customization of software according to customer requirements
    6. Full factory automation support

    Application Area：

    ● Wafer front-side and back-side cleaning pre and post furnace
    ● Pre- and post-CVD cleaning
    ● Pre- and post-PVD cleaning
    ● Pre- and post-CMP cleaning
    ● Post dry etching cleaning
    ● Wafer back-side and bevel cleaning for special processes

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