December 17, 2002 The company's predecessor, Shenyang Xinyuan Advanced Semiconductor Technology Co., Ltd., was established.
2002
In 2005 Open up a new field of 8-inch bump packaging. Track products are sold to Jiangyin Changdian, the largest packaging factory in China.
2005
In 2007 The first advanced packaging field used 12-inch Track products for sales and applications, achieving a major breakthrough in wafer size and new processes for domestic IC equipment.
2007
Year 2008 Approved to undertake the national 02 major science and technology project "bump encapsulation and development, single-chip wet etching equipment development and industrialization" project.
2008
year 2011 The core source company seized the opportunity of the great development of the LED industry, and its products successfully occupied the domestic LED market.
2011
2012 Approved to undertake the national 02 major special project "300mm wafer homogeneous development equipment research and development" project.
2012
芯源公司产品销售实现重大突破，先进封装领域用喷胶设备批量出口到台湾市场。
2013
year 2013 A major breakthrough was achieved in the sales of the company's products, and the spraying equipment for advanced packaging was exported to the Taiwan market in batches.
2013
2016 year The industry standard "General Specifications for Spray Coating Equipment" formulated by the core source company was officially promulgated and implemented.
2016
2017 year The 600th equipment of the core source company is sold.
2017
In 2018, the company's 700th equipment was shipped from the factory.
The first high-capacity front track device developed by the company, "Fengtian No. 1", leaves the factory for process verification.
On December 16, 2019, Core Source Micro was listed on the S & T board of the Shanghai Stock Exchange, becoming the "first share of the S & T board" in Liaoning Province.
2019
On July 27, 2020, the industrialization project of high-end wafer processing equipment of KINGSEMI was started
On April 15, 2021, the 1000th equipment was sold and delivered
2021
