Frame size：8 Inch
Wafer size：200mm（Compatible with 150mm）
Max throughput：20WPH
SiC dicing speed：100mm/s
Dimensions： W2730×D2260×H2230 (mm)
Advantages：
Compact design, Small footprint
Standardized unit size, Flexible configuration
High productivity, Fast dicing speed
Dry process, No liquid utility requirements
Smooth cross-section, Few burrs and minimal cracks
No Kerf-loss, More DPW
