For the field of 3D-IC、2.5D/3D Package
the separation and cleaning process of device and glass carrier after thinning.
Advantages：
Supports throughput 12 WPH
Supports factory automation
Optional laser path systems with different wavelengths according to customer needs
Flattop laser beam for uniform laser energy
Accurate control liquid 、temperature,、pressure and flow of chemical
With chemical recycling function，maximize cut down customer costs
