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Advantages:

1. Position- and speed-programmable chemical swing arm for etching uniformity.
2. Multi-cup design to support a variety of chemicals in the same chamber, and to effectively recover chemicals.
3. Multi-layer architecture for small footprint, with up to 4 etching units configurable

Application Area:

● Wet etching process in semiconductor manufacturing
● Metal film etching in UBM and RDL processes for advanced packaging
● Metals and metal oxides etching for OLED manufacturing
● ITO/IGZO etching, surface oxide removal and cleaning before buffer film, etc.