Advantages：
1. Capability of ultra-thin wafer processing and ultra-thick photoresist application (coating, development and baking)
2. Optimized design of coater module to avoid common defects of high viscosity photoresist applications
3. Fully-enclosed modules that can be configured flexibly
4. Small footprint and high throughput
5. Capability of handling wafer with large warpage (>5mm)
6. Progressive baking capability
